Industry Standard FDSOI Compact Model BSIM-IMG for IC Design
170,00 €*
Nach dem Kauf zum Download bereit Ein Downloadlink ist wenige Minuten nach dem Kauf im eigenen Benutzerprofil verfügbar.
ISBN/EAN:
9780081024027
Industry Standard FDSOI Compact Model BSIM-IMG for IC Design helps readers develop an understanding of a FDSOI device and its simulation model. It covers the physics and operation of the FDSOI device, explaining not only how FDSOI enables further scaling, but also how it offers unique possibilities in circuits. Following chapters cover the industry standard compact model BSIM-IMG for FDSOI devices. The book addresses core surface-potential calculations and the plethora of real devices and potential effects. Written by the original developers of the industrial standard model, this book is an excellent reference for the new BSIM-IMG compact model for emerging FDSOI technology. The authors include chapters on step-by-step parameters extraction procedure for BSIM-IMG model and rigorous industry grade tests that the BSIM-IMG model has undergone. There is also a chapter on analog and RF circuit design in FDSOI technology using the BSIM-IMG model. - Provides a detailed discussion of the BSIM-IMG model and the industry standard simulation model for FDSOI, all presented by the developers of the model - Explains the complex operation of the FDSOI device and its use of two independent control inputs - Addresses the parameter extraction challenges for those using this model
Chenming Hu is TSMC Distinguished Chair Professor Emeritus at the University of California, Berkeley. He was the Chief Technology Officer of TSMC. He received the US Presidential Medal of Technology and Innovation from Pres. Barack Obama for developing the first 3D thin-body transistor FinFET, MOSFET reliability models and leading the development of BSIM industry standard transistor model that is used in designing most of the integrated circuits in the world. He is a member of the US Academy of Engineering, the Chinese Academy of Science, and Academia Sinica.He received the highest honor of IEEE, the IEEE Medal of Honor, and its Andrew Grove Award, Solid Circuits Award, and the Nishizawa Medal. He also received the Taiwan Presidential Science Prize and UC Berkeley's highest honor for teaching - the Berkeley Distinguished Teaching Award.
Chenming Hu is TSMC Distinguished Chair Professor Emeritus at the University of California, Berkeley. He was the Chief Technology Officer of TSMC. He received the US Presidential Medal of Technology and Innovation from Pres. Barack Obama for developing the first 3D thin-body transistor FinFET, MOSFET reliability models and leading the development of BSIM industry standard transistor model that is used in designing most of the integrated circuits in the world. He is a member of the US Academy of Engineering, the Chinese Academy of Science, and Academia Sinica.He received the highest honor of IEEE, the IEEE Medal of Honor, and its Andrew Grove Award, Solid Circuits Award, and the Nishizawa Medal. He also received the Taiwan Presidential Science Prize and UC Berkeley's highest honor for teaching - the Berkeley Distinguished Teaching Award.
Autor: | Chenming Hu, Sourabh Khandelwal, Yogesh Singh Chauhan, Thomas Mckay, Josef Watts, Juan Pablo Duarte, |
---|---|
EAN: | 9780081024027 |
eBook Format: | ePUB/PDF |
Sprache: | Englisch |
Produktart: | eBook |
Veröffentlichungsdatum: | 21.05.2019 |
Kategorie: | |
Schlagworte: | Circuit simulations in FDSOI RF circuit design analog circuit design back-gate bias effects in FDSOI parameter extraction |
Anmelden
Möchten Sie lieber vor Ort einkaufen?
Haben Sie weiterführende Fragen zu diesem Buch oder anderen Produkten? Oder möchten Sie einfach doch lieber in der Buchhandlung stöbern? Wir sind gern persönlich für Sie da und beraten Sie auch telefonisch.
Bergische Buchhandlung R. Schmitz
Wetterauer Str. 6
42897 Remscheid-Lennep
Telefon: 02191/668255
Mo – Fr10:00 – 18:00 UhrSa09:00 – 13:00 Uhr